The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7112624 B1

PDF
Full Text
Expired
Date of Patent:
Sep. 26, 2006

Filed:

Jan. 18, 2002
Applicant:

Joseph D. Domine, Humble, TX (US);

Inventor:

Joseph D. Domine, Humble, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C08K 5/01 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention provides a copolymer of ethylene and at least 5 mol % of comonomer units derived from an alkyl acrylate or alkyl methacrylate, wherein the copolymer has a melt index of from 1 to 10,000 g/10 min, and a maximum peak melting temperature of at least 100° C. The alkyl group of the alkyl acrylate or alkyl methacrylate can be a linear or branched Cto Cgroup, particularly n-butyl. The copolymer shows increased heat resistance as characterized by a temperature required to melt 50% of the copolymer of at least 80° C., a temperature required to melt 80% of the copolymer of at least 100° C., a temperature required to melt 100% of the copolymer of at least 110° C. The invention further provides a process for copolymerizing ethylene and an alkyl acrylate or alkyl methacrylate comonomer.


Find Patent Forward Citations

Domine, Joseph. (2006). Ethylene alkyl acrylate copolymers with improved heat resistance (U.S. Patent No. 7112624). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7112624

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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