The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 2006
Filed:
Jun. 27, 2003
Hidetoshi Tsuzuki, Kanagawa, JP;
Noboru Toyama, Osaka, JP;
Yasuyoshi Takai, Nara, JP;
Ryo Hayashi, Nara, JP;
Yuichi Sonoda, Nara, JP;
Masumitsu Iwata, Kyoto, JP;
Yusuke Miyamoto, Kyoto, JP;
Hidetoshi Tsuzuki, Kanagawa, JP;
Noboru Toyama, Osaka, JP;
Yasuyoshi Takai, Nara, JP;
Ryo Hayashi, Nara, JP;
Yuichi Sonoda, Nara, JP;
Masumitsu Iwata, Kyoto, JP;
Yusuke Miyamoto, Kyoto, JP;
Canon Kabushiki Kaisha, Tokyo, JP;
Abstract
A plating apparatus includes a plating vessel for holding a plating bath containing at least metal ions, a conveying device for conveying a long conductive substrate and immersing the long conductive substrate in the plating bath, a facing electrode disposed in the plating bath so as to face one surface of the conductive substrate, a voltage application device for performing plating on the one surface of the conductive substrate by applying a voltage between the conductive substrate and the facing electrode, and a film-deposition suppression device fixedly disposed in the plating vessel so that at least a portion of the film-deposition suppression means is close to shorter-direction edges of the conductive substrate. At least a portion of the film-deposition suppression device close to the shorter-direction edges of the conductive substrate is conductive. By holding the conductive portion of the film-deposition suppression device and the conductive substrate at substantially the same potential, film deposition on the other surface of the conductive substrate is suppressed.