The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 2006
Filed:
Mar. 19, 2004
Koichi Shimamura, Kawasaki, JP;
Kazuhisa Mishima, Kawasaki, JP;
Toshiaki Otsuka, Kawasaki, JP;
Toru Okada, Kawasaki, JP;
Masanao Fujii, Kawasaki, JP;
Koichi Shimamura, Kawasaki, JP;
Kazuhisa Mishima, Kawasaki, JP;
Toshiaki Otsuka, Kawasaki, JP;
Toru Okada, Kawasaki, JP;
Masanao Fujii, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
An apparatus combining a high-speed high-precision characteristic equivalent to that of a die bonder and a flexibility of coping quickly with a process variation and product variation along with size reduction and economics. This apparatus comprises a base unit including a body containing a device to be used in common among a plurality of processes for mounting and assembling parts, a mechanism for conveying a workpiece in a predetermined conveying direction and a mechanism for positioning the workpiece, a dedicated unit including an end effector, and a selected mechanism unit including a mechanism for moving the end effector in two axial directions perpendicular to the predetermined conveying direction to adjust a relative position between the end effector and the workpiece or a part. The moving mechanism is interchangeably attached on the base unit, and the end effector is interchangeably attached on the moving mechanism.