The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 19, 2006
Filed:
Mar. 08, 2005
Prakash Gothoskar, Allentown, PA (US);
Margaret Ghiron, Allentown, PA (US);
Robert Keith Montgomery, Easton, PA (US);
Vipulkumar Patel, Breinigsville, PA (US);
Kalpendu Shastri, Orefield, PA (US);
Soham Pathak, Allentown, PA (US);
David Piede, Allentown, PA (US);
Katherine A. Yanushefski, Zionsville, PA (US);
Prakash Gothoskar, Allentown, PA (US);
Margaret Ghiron, Allentown, PA (US);
Robert Keith Montgomery, Easton, PA (US);
Vipulkumar Patel, Breinigsville, PA (US);
Kalpendu Shastri, Orefield, PA (US);
Soham Pathak, Allentown, PA (US);
David Piede, Allentown, PA (US);
Katherine A. Yanushefski, Zionsville, PA (US);
SiOptical, Inc., Allentown, PA (US);
Abstract
A wafer-level testing arrangement for opto-electronic devices formed in a silicon-on-insulator (SOI) wafer structure utilizes a single opto-electronic testing element to perform both optical and electrical testing. Beam steering optics may be formed on the testing element and used to facilitate the coupling between optical probe signals and optical coupling elements (e.g., prism couplers, gratings) formed on the top surface of the SOI structure. The optical test signals are thereafter directed into optical waveguides formed in the top layer of the SOI structure. The opto-electronic testing element also comprises a plurality of electrical test pins that are positioned to contact a plurality of bondpad test sites on the opto-electronic device and perform electrical testing operations. The optical test signal results may be converted into electrical representations within the SOI structure and thus returned to the testing element as electrical signals.