The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 19, 2006
Filed:
May. 10, 2001
Applicants:
Herbert Brunner, Regensburg, DE;
Thomas Hofer, Coppersdorf, DE;
Harald Jager, Regensburg, DE;
Inventors:
Assignee:
Osram GmbH, , DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01);
U.S. Cl.
CPC ...
Abstract
The invention relates to a semiconductor component comprising surface metallization and having at least one semiconductor body () and a package base body () on whose surface conductor path structures () are formed by means of surface metallization. A subregion of the conductor path structure () constitutes the solder connections of the semiconductor component. The solder connections () are combined to form rows, the individual rows of solder connections being arranged at a very small, predetermined spacing from one another.