The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 19, 2006
Filed:
May. 06, 2004
Edwin F. Johnson, Sunnyvale, CA (US);
Edwin F. Johnson, Sunnyvale, CA (US);
Endwave Corporation, Sunnyvale, CA (US);
Abstract
An electronic circuit can be produced by placing an electrically conductive compressible circuit bump on a circuit electrode of a mounting surface of first and second circuit devices, such as an integrated circuit and a base substrate. One or more auxiliary bumps can also be placed on one or both of the mounting surfaces of the circuit devices. During mounting, the first circuit device can be positioned over the second circuit device with the circuit bumps connecting circuit contacts on the two mounting surfaces. Pressure can be applied so that the circuit bumps and the auxiliary bumps are compressed between the chip and the base device sufficiently for adhering at least the circuit bumps to the circuit contacts.