The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 19, 2006
Filed:
Jul. 12, 2004
IN Ku Kang, Cheonan, KR;
Sang Ho Ahn, Suwon, KR;
In Ku Kang, Cheonan, KR;
Sang Ho Ahn, Suwon, KR;
Samsung Electronics Co., Ltd., Suwon, KR;
Abstract
An improved bumped chip carrier (BCC) package according to the present invention includes a resin-molded lead frame encapsulating an attached semiconductor integrated circuit (IC) and a plurality of interconnecting wire bonds attaching a plurality of contact pads on the IC to an associated plurality of solder-covered external contact terminals that are integrated in the lead frame. By integrally processing the external contact terminals, bonding wires may be affixed using a single wire bonding process. A method for manufacturing the BCC package preferably includes a dual photoresist patterning process accompanied by a dual wet etching process to create a plurality of highly reliable external contact terminals having improved bonding between the contact terminals and the encapsulating resin mold.