The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 19, 2006
Filed:
Feb. 05, 2004
Applicant:
Mitsuru Okigawa, Nagoya, JP;
Inventor:
Mitsuru Okigawa, Nagoya, JP;
Assignee:
Sanyo Electric Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 21/44 (2006.01); H01L 23/29 (2006.01); H01L 23/48 (2006.01); H01L 23/28 (2006.01); H01L 23/24 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor integrated device, provided with a semiconductor chip on which a semiconductor integrated circuit is formed and a support substrate laminated on at least one surface of the semiconductor chip, wherein the semiconductor chip and the support substrate are fastened using resin having particle-the minimum film thickness of the resin is larger than the maximum particle diameter of the filler.