The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 19, 2006
Filed:
Mar. 25, 2003
Hiroshi Itoh, Osaka, JP;
Kunihiko Shimamura, Sakai, JP;
Tooru Tanokura, Osaka, JP;
Shiro Ogawa, Osaka, JP;
Takashi Saeki, Kurashiki, JP;
Hiroshi Itoh, Osaka, JP;
Kunihiko Shimamura, Sakai, JP;
Tooru Tanokura, Osaka, JP;
Shiro Ogawa, Osaka, JP;
Takashi Saeki, Kurashiki, JP;
Kuraray Co., Ltd., Kurashiki, JP;
Abstract
The mold-in fastening member comprises a substrate having engaging elements on a top surface thereof and a foamed synthetic resin layer bonded to a rear surface of the substrate. The foamed synthetic resin layer has overhanging marginal portions or sealing portions extending outwardly beyond at least both lateral edges of the substrate. The foamed synthetic resin layer has a thickness of 1 to 10 mm and an initial compressive modulus of 0.02 to 1.0 MPa. The mold-in fastening member surely prevents a molding resin from entering through gaps between the mold-in fastening member and a recess formed in a mold.