The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 19, 2006

Filed:

Feb. 28, 2003
Applicants:

Yue Xiao, Belle Mead, NJ (US);

Sun Hee Lehmann, Hillsborough, NJ (US);

Chih-min Cheng, Westford, MA (US);

Gunther Dreezen, Olmen, BE;

Inventors:

Yue Xiao, Belle Mead, NJ (US);

Sun Hee Lehmann, Hillsborough, NJ (US);

Chih-Min Cheng, Westford, MA (US);

Gunther Dreezen, Olmen, BE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 1/22 (2006.01); H01L 23/48 (2006.01); C09K 3/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A composition that comprises a) an admixing of at least one epoxy resin and aliphatic amine wherein the ratio of epoxy function group/amine is greater than 1; b) a conductive filler; c) one or more corrosion inhibitors, oxygen scavengers or both; d) imidazole as a curing agent/catalyst; and e) optionally other additives such as organic solvents, flow additives, adhesion promoters and rheology modifiers. The reaction of epoxy and aliphatic amine with excess epoxy functionality results in a flexible resin with remaining active epoxy groups. The compositions exhibit improved electrical stability and impact resistance over other conductive adhesive compositions that do not comprise the admixture.


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