The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 12, 2006

Filed:

Sep. 07, 2004
Applicants:

Wen-lung Yu, Taipei, TW;

Ying-chun Chou, Taipei, TW;

Kun-chih LU, Taipei, TW;

Inventors:

Wen-Lung Yu, Taipei, TW;

Ying-Chun Chou, Taipei, TW;

Kun-Chih Lu, Taipei, TW;

Assignee:

Shutlle Inc., Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

A heat dissipating system provides a fast heat dissipating airflow stream inside a desktop computer and thereby greatly enhances the heat dissipating efficiency of the desktop computer. The computer heat dissipating system includes a computer chassis which has a circular opening bored on its front plate, a motherboard which has a thermal module including a front cooling fan and a set of chipsets heatsink module installed on its top surface, and a power supply with a cooling fan. The thermal module, the chipsets heatsink module, and the power supply are aligned along a single heat dissipating airflow stream. The external low temperature air first passes through the thermal module and removes the heat generated by the central processing unit, further flows into the chipsets heatsink module and removes the heat generated by the MCH chipsets and ICH chipsets, and finally enters into the power supply and removes the heat generated by the power supply. The cooling fan of the power supply further facilitates the exhaust of the heated airflow.


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