The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 12, 2006

Filed:

Jun. 04, 2003
Applicants:

Benjamin P. Abbott, Longwood, FL (US);

Svetlana Malocha, Winter Springs, FL (US);

Jack Chocola, Lake Mary, FL (US);

Gary Monetti, Apopka, FL (US);

Josh Zepress, Oviedo, FL (US);

Inventors:

Benjamin P. Abbott, Longwood, FL (US);

Svetlana Malocha, Winter Springs, FL (US);

Jack Chocola, Lake Mary, FL (US);

Gary Monetti, Apopka, FL (US);

Josh Zepress, Oviedo, FL (US);

Assignee:

Sawtek, Inc., Orlando, FL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/08 (2006.01);
U.S. Cl.
CPC ...
Abstract

A SAW filter includes a piezoelectric substrate of Lithium Niobate or optionally Lithium Tantalate having a thickness of at least twice an acoustic wavelength. The piezoelectric substrate is bonded to a surrogate substrate of a silicon material. The surrogate substrate is characterized by a resisitivity of at least 100 ohm-cm and an expansion coefficient compatible with the piezoelectric substrate. A catalytic bonding film between the piezoelectric substrate and the surrogate substrate is formed from a first catalytic bonding film deposited onto a surface of the piezoelectric substrate and a second catalytic bonding film deposited onto a surface of the surrogate substrate. The piezoelectric substrate is bonded to the surrogate substrate through a compression force sufficient for providing a bonding at a normal temperature.


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