The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2006
Filed:
Jun. 18, 2004
Kazuya Kodani, Kawasaki, JP;
Nobuhiro Shingai, Tokyo, JP;
Kazuya Kodani, Kawasaki, JP;
Nobuhiro Shingai, Tokyo, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
A power semiconductor module comprises a wide band gap semiconductor chip having its surface with an electrode provided thereon, and more than one bonding wire which is connected to an edge portion of the electrode directly or indirectly via an electrode pad. The electrode and the electrode pad have their thickness values that are specifically set in such a way as to obtain a conduction area ratio equal to or greater than a conduction area ratio of the wide band gap semiconductor chip in the case where a respective one of the electrode and electrode pad is made of aluminum while letting a total thickness value of the electrode and the electrode pad measure ten micrometers (10 μm).