The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2006
Filed:
Mar. 04, 2004
Katsuhiko Shishido, Takatsuki, JP;
Motonobu Nishimura, Otsu, JP;
Hisakazu Kotani, Takaraduka, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A first semiconductor chipincludes an integrated circuit formed on a face which is shown upwards in FIG.. A second semiconductor chipincludes an integrated circuit formed on a face which is shown downwards in FIG.. Between the first semiconductor chipand the second semiconductor chip, a non-conductive die padis interposed. The die padis provided with connection membersprotruding from the first semiconductor chipand the second semiconductor chip. The connection membersare plated on their surfaces so as to be electrically conductive. The integrated circuit on the first semiconductor chipand the integrated circuit on the second semiconductor chipare interconnected by two inter-chip connection wiresand, via the connection members. Thus, there is provided a semiconductor device composed of a plurality of internally connected semiconductor chips, such that the semiconductor device is easy to produce and requires a reduced number of component elements.