The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7105917 B1

PDF
Full Text
Expired
Date of Patent:
Sep. 12, 2006

Filed:

Sep. 13, 2001
Applicants:

Kang-sik Cho, Kyunggi-do, KR;

Chul-sung Park, Seoul, KR;

Gyu-chul Kim, Kyunggi-do, KR;

Inventors:

Kang-Sik Cho, Kyunggi-do, KR;

Chul-Sung Park, Seoul, KR;

Gyu-Chul Kim, Kyunggi-do, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device and a fabrication method thereof are provided. The semiconductor device has a probing pad formed on a chip. The probing pad is connected to an output pad and an internal circuit though a fuse. After an electrical testing of the chip by the probing pad, the fuse is cut by a laser beam. Therefore, the probing pad is disconnected from the output pad and the internal circuit. The output pad is connected to an output lead of a package, which is encapsulating the chip. According to the device and the fabrication methods thereof, performance of the device can be enhanced by a low parasitic capacitance and a low parasitic resistance.


Find Patent Forward Citations

Cho, Kang-Sik. (2006). Semiconductor device having a fuse connected to a pad and fabrication method thereof (U.S. Patent No. 7105917). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7105917

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