The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2006
Filed:
Jun. 28, 2002
Yoshitsugu Morita, Chiba prefecture, JP;
Hiroshi Ueki, Chiba Prefecture, JP;
Koji Nakanishi, Chiba Prefecture, JP;
Haruhiko Furukawa, Chiba Prefecture, JP;
Yoshitsugu Morita, Chiba prefecture, JP;
Hiroshi Ueki, Chiba Prefecture, JP;
Koji Nakanishi, Chiba Prefecture, JP;
Haruhiko Furukawa, Chiba Prefecture, JP;
Abstract
A curable epoxy resin composition comprising at least: (A) a crystalline epoxy resin, (B) a phenol resin, and (C) a silicone resin composed of epoxy-containing organic groups and phenyl groups that define an average unit formula of this component. Component (C) is used in an amount of 0.1 to 500 parts by weight for 100 parts by weight of the sum of weights of components (A) and (B). The composition of the invention is suitable for transfer and injection molding and may find use as a curable epoxy resin composition for sealing parts of electrical and electronic devices.