The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2006
Filed:
Jan. 14, 2005
Kwong-hon Wong, Wappingers Falls, NY (US);
Louis C. Hsu, Fishkill, NY (US);
Timothy J. Dalton, Ridgefield, CT (US);
Carl J. Radens, LaGrangeville, NY (US);
Chih-chao Yang, Poughkeepsie, NY (US);
Lawrence A. Clevenger, LaGrangeville, NY (US);
Theodorus E. Standaert, Pine Bush, NY (US);
Kwong-Hon Wong, Wappingers Falls, NY (US);
Louis C. Hsu, Fishkill, NY (US);
Timothy J. Dalton, Ridgefield, CT (US);
Carl J. Radens, LaGrangeville, NY (US);
Chih-Chao Yang, Poughkeepsie, NY (US);
Lawrence A. Clevenger, LaGrangeville, NY (US);
Theodorus E. Standaert, Pine Bush, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method of making an interconnect which includes providing an interconnect structure in a dielectric material, recessing the dielectric material such that a portion of the interconnect structure extends above an upper surface of the dielectric and depositing an encasing cap over the extended portion of the interconnect structure.