The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 12, 2006

Filed:

Dec. 30, 2003
Applicant:

Kwan-ju Koh, Bucheon, KR;

Inventor:

Kwan-Ju Koh, Bucheon, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01);
U.S. Cl.
CPC ...
Abstract

Methods for forming a contact hole in a semiconductor device are disclosed. A disclosed method is capable of preventing voids from being formed in a contact hole or a via hole. In particular, when a metal insulation film or an interlayer insulation film is selectively etched to form a contact hole or a via hole, a top edge of the contact hole or the via hole is rounded by using a plasma having spiral movement.


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