The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2006
Filed:
Sep. 10, 2002
Susumu Sakamoto, Nagoya, JP;
Masayuki Hiroshima, Nagoya, JP;
Shigeo Mori, Nagoya, JP;
Eiji Naraki, Nagoya, JP;
Koichi Sato, Nagoya, JP;
Hirotoshi Takechi, Nagoya, JP;
Susumu Sakamoto, Nagoya, JP;
Masayuki Hiroshima, Nagoya, JP;
Shigeo Mori, Nagoya, JP;
Eiji Naraki, Nagoya, JP;
Koichi Sato, Nagoya, JP;
Hirotoshi Takechi, Nagoya, JP;
Noritake Co., Limited, Nagoya, JP;
Abstract
A thick-film sheet member producing method including: (a) a support-body preparing step of preparing a support body having a film formation surface provided by a particle layer constituted by high-melting-point particles which are held together with a resin and which have a melting point higher than a predetermined temperature; (b) a paste-film forming step of forming a paste film on the film formation surface, by applying a paste onto the film formation surface; and (c) a firing step of subjecting the support body on which the paste film has been formed, to a heat treatment effected at the predetermined temperature, so as to burn the resin included in the particle layer, whereby the high-melting-point particles become unbound from each other in absence of the resin that has been burned. The paste film is sintered in the firing step, whereby a thick film is formed of the sintered paste film.