The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 12, 2006

Filed:

Sep. 09, 2004
Applicants:

Yukio Iwata, Toyota, JP;

Yoshiharu Isoshima, Okazaki, JP;

Inventors:

Yukio Iwata, Toyota, JP;

Yoshiharu Isoshima, Okazaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29B 11/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

An injection molding apparatus has a die having a fixed mold and a moveable mold disposed to face with each other. A frame structure is detachably provided on the outer surfaces of the fixed mold and the moveable mold, that is, opposite to the surface of the cavity defined by the fixed mold and the moveable mold. Each frame that constitutes the frame structure has a shape that can be combined together. One of frames provided on the fixed mold or the moveable mold is fixed thereto in a die clamping direction or a direction perpendicular thereto. The frame is fixed to the fixed mold of the die, leaving a predetermined gap in the direction perpendicular to that for fixing the frame structure to the die. The pressurizing mechanism that applies a pressing force in the direction other than for fixing the frame structure to the die. The hydraulic control mechanism is employed as the pressurizing mechanism.


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