The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2006
Filed:
Feb. 26, 2004
Tsutomu Maekawa, Hitachinaka, JP;
Akemi Ouchi, Hitachinaka, JP;
Hidetoshi Fujii, Hitachinaka, JP;
Kunihiro Tamahashi, Hitachinaka, JP;
Yutaka Shoji, Hitachinaka, JP;
Hiroshi Takahagi, Hitachinaka, JP;
Tsutomu Maekawa, Hitachinaka, JP;
Akemi Ouchi, Hitachinaka, JP;
Hidetoshi Fujii, Hitachinaka, JP;
Kunihiro Tamahashi, Hitachinaka, JP;
Yutaka Shoji, Hitachinaka, JP;
Hiroshi Takahagi, Hitachinaka, JP;
Ricoh Printing Systems, Ltd., Tokyo, JP;
Abstract
A three-dimensional laminating molding device includes ejection heads that eject support material for a support, and an ejection head that ejects mold material for a mold. The support material is sold at room temperature. An inner temperature of the laminating molding device during the laminating molding is controlled to a range of (a melting point of the support material−30)° C. to (the melting point of the support material−5)° C.