The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2006
Filed:
May. 18, 2004
Eriko Ajioka, Tokyo, JP;
Shigeru Asami, Tokyo, JP;
Hideaki Shimoda, Tokyo, JP;
Hiroshi Ikeda, Tokyo, JP;
Yoshinari Yamashita, Tokyo, JP;
Hitoyoshi Kurata, Tokyo, JP;
Eriko Ajioka, Tokyo, JP;
Shigeru Asami, Tokyo, JP;
Hideaki Shimoda, Tokyo, JP;
Hiroshi Ikeda, Tokyo, JP;
Yoshinari Yamashita, Tokyo, JP;
Hitoyoshi Kurata, Tokyo, JP;
TDK Corporation, Tokyo, JP;
Abstract
An electronic component module according to the invention includes: a mounting substrateincluding a shield layerand on which a first cavityand a second cavityare formed; a first electronic componentpositioned in the first cavityand used in a first frequency band; a second electronic componentpositioned in the second cavityand used in a second frequency band; lid memberswhich seal the first cavityand the second cavity; and patch antennaswhich transmit/receive radio waves in the frequency bands, the antennas connected to the electronic components; wherein the electronic componentsare mounted on the mounting substratevia a substrate componenthaving a higher heat resistance than the mounting substrateand that the mounting substrateis composed of a member having a lower dielectric constant that the substrate component