The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 05, 2006

Filed:

Oct. 28, 2004
Applicants:

Haruyuki Tsuji, Ina, JP;

Yasutoshi Kitahara, Ina, JP;

Katsuyuki Hashimoto, Hachioji, JP;

Yasunori Ikeno, Okaya, JP;

Shunsuke Kurata, Kamiina-gun, JP;

Masahiko Yazawa, Hachioji, JP;

Inventors:

Haruyuki Tsuji, Ina, JP;

Yasutoshi Kitahara, Ina, JP;

Katsuyuki Hashimoto, Hachioji, JP;

Yasunori Ikeno, Okaya, JP;

Shunsuke Kurata, Kamiina-gun, JP;

Masahiko Yazawa, Hachioji, JP;

Assignee:

Olympus Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor wafer inspection apparatus is provided with a rotatable table on which a semiconductor wafer is held by suction, an illuminating device which illuminates at least an edge portion of the semiconductor wafer held on the rotatable table, an imaging device which captures an image of the edge portion of the semiconductor wafer when the edge portion is illuminated by the illuminating device, an image processing device which detects at least an edge cut amount or a crack by acquiring the image of the edge portion which is captured by the imaging device, and a display section which displays an image of the edge portion subjected to image processing by the image processing device.


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