The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 05, 2006

Filed:

May. 17, 2004
Applicants:

Toru Iwagami, Tokyo, JP;

Shinya Shirakawa, Tokyo, JP;

Mamoru Seo, Tokyo, JP;

Masaki Sakai, Fukuoka, JP;

Dong Wang, Tokyo, JP;

Inventors:

Toru Iwagami, Tokyo, JP;

Shinya Shirakawa, Tokyo, JP;

Mamoru Seo, Tokyo, JP;

Masaki Sakai, Fukuoka, JP;

Dong Wang, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/26 (2006.01);
U.S. Cl.
CPC ...
Abstract

A power semiconductor module has a detector for detecting main circuit current passing through a power semiconductor element. The detector includes first and second circuit patterns; a bonding wire connected at first and second bonding points with the first and second circuit patterns, respectively; and a pair of terminal patterns extended from near the first and second bonding points of the first and second circuit patterns. The detector is designed to detect a potential difference between the pair of terminal patterns generated by flowing main circuit current through the first circuit pattern, the bonding wire and then the second circuit pattern, in order to detect a potential difference across the bonding wire.


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