The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2006
Filed:
Sep. 20, 2004
Applicants:
Heung-woo Park, Seoul, KR;
Jong-hyeong Song, Kyunggi-do, KR;
Inventors:
Heung-Woo Park, Seoul, KR;
Jong-Hyeong Song, Kyunggi-do, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
An embedded IC packaging structure is disclosed. The embedded IC packaging structure allows a micro-electro-mechanical system (MEMS) having a great number of electrodes to be bonded to another semiconductor device, such as a driver IC, using a secondary substrate, thus ensuring an easy bonding process, providing IC devices capable of executing high-speed signal processing, reducing the production costs, and improving the production yield of the IC devices.