The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2006
Filed:
Nov. 15, 2002
Nan-tsung Huang, Tu-Chen, TW;
Chong Shin Mou, Tu-Chen, TW;
Nan-Tsung Huang, Tu-Chen, TW;
Chong Shin Mou, Tu-Chen, TW;
Hon Hai Precision Ind. Co., Ltd., Taipei Hsien, TW;
Abstract
An optoelectronic package () includes a base substrate (), a plurality of solder pads () and a can (). The base substrate includes a mounting seat () laminated first and second layer (). The solder pads () respectively attach to a top surface () and a bottom surface () of the base substrate and are electrically interconnected with each other via conductive material filled the through-holes () and conductor trace (). Optoelectronic components (not shown) are attached to the top surface of the base substrate and make electrical connection with the solder pads. The can includes a transparent device (), an metal enclosure () and a housing (), which hermetically seals to the base substrate protecting the optoelectronic components.