The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2006
Filed:
May. 27, 2005
Applicant:
Jae Jung Lee, Seoul, KR;
Inventor:
Jae Jung Lee, Seoul, KR;
Assignee:
Hynix Semiconductor Inc., Icheon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01);
U.S. Cl.
CPC ...
Abstract
Provided is a method for forming a metal line in a semiconductor device. The method forms round portions at top edges of an insulation film by means of a polymer and then etches the rest portion (i.e., sidewall parts) in an almost vertical direction, which makes it possible to shrink down a width of a patterned insulation film at maximum nevertheless of a dimension of a metal-line patterning mask. By way the method, an interval between adjacent metal lines is extended at maximum, preventing mutual interference between the metal lines.