The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7100417 B1

PDF
Full Text
Expired
Date of Patent:
Sep. 05, 2006

Filed:

Nov. 13, 2003
Applicants:

Shigeaki Yamanaka, Hiroshima, JP;

Takeshi Kazama, Hiroshima, JP;

Inventors:

Shigeaki Yamanaka, Hiroshima, JP;

Takeshi Kazama, Hiroshima, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B21J 13/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An improved lower die assembly is provided which allows a given lower die in a pressing machine to be replaced with another easily and in a short period of time relative to a die holder. In the lower die assembly in which a lower die is received and securely held in a die holder, the improvement comprises: a clamp means whereby the lower die when unclamped is received in the die holder so that the lower die can be extracted from the die holder upwards and then when clamped is securely held therein; and a lift means disposed below the lower die and whereby the lower die when unclamped is raised above an upper end of the die holder.


Find Patent Forward Citations

Yamanaka, Shigeaki. (2006). Lower die assembly in pressing machine (U.S. Patent No. 7100417). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7100417

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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