The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 05, 2006

Filed:

Mar. 15, 2004
Applicants:

Randall G. Kemink, Poughkeepsie, NY (US);

Prabjit Singh, Poughkeepsie, NY (US);

Inventors:

Randall G. Kemink, Poughkeepsie, NY (US);

Prabjit Singh, Poughkeepsie, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23P 15/26 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for manufacturing a heat sink including heating a metal base to melt solder in grooves formed in the base. The base has a first coefficient of thermal expansion. The solder has a second coefficient of thermal expansion lower than the first coefficient of thermal expansion. The metal base and the solder are cooled and the metal base experiences tensile stresses and the solder experiences compressive stresses to form a concavity in a thermal face of the base. The thermal face is then planed. Over time, the tensile stresses and the compressive stresses reduce such that the thermal face becomes convex.


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