The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2006

Filed:

Mar. 29, 2005
Applicants:

Shunsuke Matsubara, Yamanashi, JP;

Shinichi Horikoshi, Yamanashi, JP;

Hajime Makita, Yamanashi, JP;

Inventors:

Shunsuke Matsubara, Yamanashi, JP;

Shinichi Horikoshi, Yamanashi, JP;

Hajime Makita, Yamanashi, JP;

Assignee:

Fanuc LTD, Yamanashi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/34 (2006.01);
U.S. Cl.
CPC ...
Abstract

In the motor driving system, a unit to predict the separation of the wire is built into the power semiconductor module thereby to predict that the time of separation of the wire is approaching before the actual separation of the wire. Thus, the time to replace the power semiconductor module used for power devices such as the motor driving system is clarified to prevent an operation failure of the motor driving system from occurring. The power semiconductor module () has a power semiconductor chip () mounted thereon, and the power semiconductor chip () includes a main circuit wire () and a dummy wire () connected to the electrode () of the power semiconductor. The dummy wire is set to a lower connection strength than the main circuit wire.


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