The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2006
Filed:
Nov. 20, 2002
Applicant:
Jacob Wijdenes, Eindhoven, NL;
Inventor:
Jacob Wijdenes, Eindhoven, NL;
Assignee:
Koninklijke Phllips Electronics N.V., Eindhoven, NL;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
Abstract
A package of a semiconductor device comprising an integrated circuit () generally comprises an inner layer () and an outer layer (), which layers () have a mutual interface (). An improved stability of the package is realized in that the interface () encloses a delamination area (), which area () is isolated from any bond pads () of the integrated circuit (). The delamination area () may be created by a pattern-wise activation of a surface of the inner layer (). A quantity of a curable polymer may be disposed on this surface to achieve this.