Embedded redistribution interposer for footprint compatible chip package conversion

Abstract

An embedded redistribution interposer is disclosed for providing footprint compatible chip package migration in which a die designed to be mounted into chip package is originally implemented using a first type of silicon platform and is subsequently redesigned for a second type of silicon platform, resulting in a redesigned die being a different size than the original die and no longer compatible for mounting in the chip package. According to the present invention, the embedded redistribution interposer includes a substrate having a plurality of bond pads on a top side thereof, wherein the redesigned die is mounted to the top of the interposer substrate, and the bottom of the interposer substrate is mounted to the substrate of the chip package. The redesigned die is connected to the redistribution interposer via a first set of electrical connections coupled between the die and the interposer bond pads. The redistribution interposer is then connected to the package via a second set of electrical connections coupled between the interposer bond pads and a package substrate, wherein signals from the die are redistributed in a manner that increases die fan-out without violating assembly rules, thereby eliminating the need to redesign the chip package to accommodate the redesigned die, resulting in a footprint compatible package.