The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2006
Filed:
Oct. 14, 2003
Sergio Camerlo, Cupertino, CA (US);
Lekhanh N. Dang, San Jose, CA (US);
Sergio Camerlo, Cupertino, CA (US);
Lekhanh N. Dang, San Jose, CA (US);
Cisco Technology, Inc., San Jose, CA (US);
Abstract
A circuit board assembly includes a printed circuit board (PCB). The PCB has a pad layout which includes a set of pads arranged in a two-dimensional array having at least two pads in a first direction and at least two pads in a second direction that is substantially perpendicular to the first direction. Each pad has (i) a central portion and (ii) multiple lobe portions integrated with the central portion and extending from the central portion of that pad. The circuit board assembly further includes a circuit board component mounted to the pad layout via a set of solder joints. The above-described pad layout (or land pattern) is well-suited for soldering to a variety of AAP devices (e.g., either a CCGA device or a BGA device).