The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2006
Filed:
Mar. 01, 2002
Stanislav A. Garyainov, Moscow, RU;
Alexander S. Gotman, Santa Monica, CA (US);
Vladimir V. Novikov, Saint Petersburg, RU;
Stanislav A. Garyainov, Moscow, RU;
Alexander S. Gotman, Santa Monica, CA (US);
Vladimir V. Novikov, Saint Petersburg, RU;
AGNG, LLC, Santa Monica, CA (US);
Abstract
A method for assembling semiconductor packages () includes forming corresponding pairs of conductive pads () on respective surfaces of a die () and an interconnective substrate (). Each pad in each pair includes an upper portion comprising at least one component of an electrically conductive eutectic alloy. Sharp, upstanding peaks () are formed on at least one of the pads in each pair. The die and substrate are forcefully abutted and the pads heated until the sharp peaks penetrate through oxide films () on the respective opposing pads in each pair and contact the upper surface of the other pad therein, thereby initiating pad fusion. The pads are then cooled to solidify the molten portions thereof into an electrically conductive joint between each corresponding pair of pads and a hermetic seal around the periphery of the package.