The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2006
Filed:
Nov. 06, 2001
Applicants:
Yasuaki Sugano, Hyogo, JP;
Yasuharu Nojima, Osaka, JP;
Inventors:
Yasuaki Sugano, Hyogo, JP;
Yasuharu Nojima, Osaka, JP;
Assignee:
Huntsman Advanced Materials Americas Inc., The Woodlands, TX (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/38 (2006.01); G03F 7/40 (2006.01); G03F 7/30 (2006.01); G03F 7/038 (2006.01); G03F 7/039 (2006.01); B32B 3/10 (2006.01); H05K 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A positive type, photosensitive epoxy resin composition comprising (a) an epoxy resin having two or more epoxy groups in one molecule, (b) a modified phenolic resin having a triazine ring, (c) a latent basic curing agent and (d) a photosensitive acid generator; and a preferably multilayered printed circuit board of buildup mode using said composition as an insulating layer.
Sugano, Yasuaki. (2006). Positive type photosensitive epoxy resin composition and printed circuit board using the same (U.S. Patent No. 7097958). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7097958
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile