The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2006
Filed:
Aug. 28, 2002
Katsufumi Tanaka, Kariya, JP;
Tomohei Sugiyama, Kariya, JP;
Kyoichi Kinoshita, Kariya, JP;
Takashi Yoshida, Kariya, JP;
Eiji Kono, Kariya, JP;
Hidehiro Kudo, Kariya, JP;
Manabu Miyoshi, Kariya, JP;
Katsufumi Tanaka, Kariya, JP;
Tomohei Sugiyama, Kariya, JP;
Kyoichi Kinoshita, Kariya, JP;
Takashi Yoshida, Kariya, JP;
Eiji Kono, Kariya, JP;
Hidehiro Kudo, Kariya, JP;
Manabu Miyoshi, Kariya, JP;
Kabushiki Kaisha Toyota Jidoshokki, Kariya, JP;
Abstract
A plate-shaped composite material has a first member and a second member. The first member is an expanded metal formed of a metal plate. The coefficient of linear expansion of the metal plate is less than or equal to 8×10/degrees Celsius. The first member suppresses thermal expansion of the composite material. The coefficient of thermal conductivity of the second member is greater than or equal to 200 W/(m×K). The second member maintains the coefficient of thermal conductivity of the composite material. This structure provides a reliable coefficient of thermal conductivity and high strength. The structure is suitable for a cooling substrate on which electronic elements such as semiconductors are mounted.