The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7097537 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 29, 2006

Filed:

Aug. 18, 2004
Applicants:

Jeffrey Drue David, San Jose, CA (US);

Nils Johansson, Los Gatos, CA (US);

Manoocher Birang, Los Gatos, CA (US);

Boguslaw A. Swedek, Cupertino, CA (US);

Ingemar Carlsson, Milpitas, CA (US);

Inventors:

Jeffrey Drue David, San Jose, CA (US);

Nils Johansson, Los Gatos, CA (US);

Manoocher Birang, Los Gatos, CA (US);

Boguslaw A. Swedek, Cupertino, CA (US);

Ingemar Carlsson, Milpitas, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B49D 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A chemical mechanical polishing apparatus and method can use an in-situ monitoring system. A measurement of a position of a carrier head and a sinusoidal first function can be used to define a second function that associates measurements from the series with positions on the substrate. For each measurement in a series from the in-situ monitoring system, the second function can be used to determine a position on the substrate where the measurement was taken. In addition, a measurement of the position of the carrier head, a time when the measurement of the substrate property is made, and a phase correction representing lag resulting from a processing delay in generating the measurement of the position of the carrier head can be used in determining a position on the substrate where a measurement of a substrate property was taken.


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