The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2006

Filed:

Dec. 28, 2004
Applicants:

Shih-wei Hsiao, Tu-Chen, TW;

Chao-chung Cheng, Tu-Chen, TW;

Yao-chi Huang, Tu-Chen, TW;

Inventors:

Shih-Wei Hsiao, Tu-Chen, TW;

Chao-Chung Cheng, Tu-Chen, TW;

Yao-Chi Huang, Tu-Chen, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/00 (2006.01); H05K 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An electrical connector () is used for electrically connecting a ball grid array (BGA) central processing unit (CPU) () with a printed circuit board (PCB). The connector includes a generally rectangular insulative housing () and a number of terminals () received in the housing. Each of the terminals includes a connecting portion (), a solder pad () extending from a bottom end of the connecting portion, and a cantilever () extending aslant from a top end of the connecting portion. The cantilever has a concave portion () near a free end thereof. When the CPU with a multiplicity of solder balls is attached onto the connector, the concave portions of the terminals cover bottom portions of the solder balls. Therefore, the terminals of the connector electrically connect with the solder balls of the CPU steadily, and a reliable connection between the CPU and the PCB is established.


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