The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2006
Filed:
Jul. 28, 2003
Hiroshi Koyama, Kariya, JP;
Tetsuya Kuno, Kariya, JP;
Hiroshi Koyama, Kariya, JP;
Tetsuya Kuno, Kariya, JP;
Toyoda Boshoku Corporation, Kariya, JP;
Abstract
A manufacturing device for a synthetic resin hollow molded body molds a first split assembly member, a second split assembly member, and a third split assembly member by a first injection, and joints each of contact portions of the three members with a corresponding contact portion by a second injection. The manufacturing device includes an ejecting mechanism which moves the second split assembly member in a die opening/closing direction, a rotating mechanism which rotates the third split assembly member around a shaft center in the die opening/closing direction, and a sliding mechanism which slides the second split assembly member and the third split assembly member in a direction perpendicular to the die opening/closing direction. According to the manufacturing device, while the dies are open after the first injection, the three members are made different by the ejecting mechanism, and then the three members are made to face one another by the rotation mechanism and the sliding mechanism in the die opening/closing direction.