The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2006

Filed:

Dec. 20, 2001
Applicants:

Takashi Katsumata, Kariya, JP;

Hirofumi Higuchi, Okazaki, JP;

Inventors:

Takashi Katsumata, Kariya, JP;

Hirofumi Higuchi, Okazaki, JP;

Assignee:

Denso Corporation, Kariya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01P 15/125 (2006.01); G01P 3/483 (2006.01); H01L 29/84 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device includes gaps formed in a semiconductor substrate to provide an inner portion movable in x and y directions. Drive electrodes vibrate the inner portion in the x direction, and detection electrodes detect movement in the y direction generated when an angular velocity is applied thereto. Monitor electrodes generate monitor signals for monitoring movement of the inner portion in the x direction. Shield wires are provided between the drive and detection electrodes and the monitor electrodes to suppress capacitive coupling. Dummy electrodes adjacent to the output electrodes and capacitively coupled to the drive electrodes generate a dummy signal. Dummy signal wires are respectively connected to the dummy electrodes and to the circuit substrate. The dummy signal includes an induced component of a periodical signal and is supplied to the circuit substrate to cancel another induced component of the periodical signal in the drive and monitor signals.


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