The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2006
Filed:
Jul. 10, 2003
Erik Nilsen, McKinney, TX (US);
Matthew D. Ellis, Allen, TX (US);
Charles L. Goldsmith, Plano, TX (US);
Jeong Bong Lee, Plano, TX (US);
Xiaojun Huang, Goleta, CA (US);
Arun Kumar Nallani, Richardson, TX (US);
Kabseog Kim, Dallas, TX (US);
George D. Skidmore, Richardson, TX (US);
Erik Nilsen, McKinney, TX (US);
Matthew D. Ellis, Allen, TX (US);
Charles L. Goldsmith, Plano, TX (US);
Jeong Bong Lee, Plano, TX (US);
Xiaojun Huang, Goleta, CA (US);
Arun Kumar Nallani, Richardson, TX (US);
Kabseog Kim, Dallas, TX (US);
George D. Skidmore, Richardson, TX (US);
Zyvex Corporation, Richardson, TX (US);
Abstract
A new process and structure for microcomponent interconnection utilizing a post-assembly activated junction compound. In one embodiment, first and second microcomponents having respective first and second contact areas are provided. A junction compound is formed on one of the first and second contact areas, and the first and second contact areas are positioned adjacent each other on opposing sides of the junction compound. The junction compound is then activated to couple the first and second microcomponents.