The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 2006
Filed:
Jan. 07, 2004
Hisaki Kurashina, Matsumoto, JP;
Hisaki Kurashina, Matsumoto, JP;
Seiko Epson Corporation, Tokyo, JP;
Abstract
A plurality of film formation layers where film formation patterns are formed, respectively, interlayer films which are formed between the plurality of film formation layers, respectively, a plurality of sub-interlayer-film wiring patterns, which are formed in film formation layers beneath the planarized interlayer films of the interlayer films, a plurality of contact holes formed in the planarized interlayer films in order to connect the plurality of sub-interlayer-film wiring patterns and the film formation patterns of layers above the planarized interlayer films, and one or more dummy patterns which are formed on a plurality of positions under the plurality of contact holes and which are formed in one or more film formation layers under the plurality of sub-interlayer-film wiring patterns, respectively so as to control the positions of the surfaces of the plurality of sub-interlayer-film wiring patterns.