The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 2006
Filed:
Jul. 14, 2003
Shoichi Osada, Usui-gun, JP;
Eiichi Asano, Usui-gun, JP;
Shigeki Ino, Usui-gun, JP;
Takayuki Aoki, Usui-gun, JP;
Kazutoshi Tomiyoshi, Usui-gun, JP;
Toshio Shiobara, Usui-gun, JP;
Shoichi Osada, Usui-gun, JP;
Eiichi Asano, Usui-gun, JP;
Shigeki Ino, Usui-gun, JP;
Takayuki Aoki, Usui-gun, JP;
Kazutoshi Tomiyoshi, Usui-gun, JP;
Toshio Shiobara, Usui-gun, JP;
Shin-Etsu Chemical Co., Ltd., Tokyo, JP;
Abstract
A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, (D-i) an organopolysiloxane, (D-ii) an organopolysiloxane cured product, or (D-iii) a block copolymer obtained by reacting an epoxy resin or alkenyl group-bearing epoxy resin with an organohydrogenpolysiloxane, and (E) an inorganic filler. The composition has improved moldability and solder crack resistance while exhibiting high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.