The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 2006
Filed:
Nov. 29, 2004
Shuichi Chiba, Sagamihara, JP;
Masahiko Ishiguri, Kawasaki, JP;
Koichi Murata, Kawasaki, JP;
Eiji Watanabe, Kawasaki, JP;
Michiaki Tamagawa, Aizuwakamatsu, JP;
Akira Satoh, Aizuwakamatsu, JP;
Yasushi Toida, Aizuwakamatsu, JP;
Kazuhiro Misawa, Aizuwakamatsu, JP;
Shuichi Chiba, Sagamihara, JP;
Masahiko Ishiguri, Kawasaki, JP;
Koichi Murata, Kawasaki, JP;
Eiji Watanabe, Kawasaki, JP;
Michiaki Tamagawa, Aizuwakamatsu, JP;
Akira Satoh, Aizuwakamatsu, JP;
Yasushi Toida, Aizuwakamatsu, JP;
Kazuhiro Misawa, Aizuwakamatsu, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A semiconductor device includes a substrate, a pad electrode formed on the substrate and a bump electrode formed on the pad electrode, wherein the pad electrode has an irregular flaw, and there is provided a pattern covering the irregular flaw between the pad electrode an the bump electrode.