The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 22, 2006

Filed:

Nov. 20, 2003
Applicants:

Suresh K. Chengalva, Kokomo, IN (US);

David W. Ihms, Russiaville, IN (US);

Bruce A. Myers, Kokomo, IN (US);

Inventors:

Suresh K. Chengalva, Kokomo, IN (US);

David W. Ihms, Russiaville, IN (US);

Bruce A. Myers, Kokomo, IN (US);

Assignee:

Delphi Technologies, Inc., Troy, MI (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
Abstract

A circuit board assembly comprising a laminate substrate and a surface mount device having a CTE less than that of the laminate substrate and attached with at least one solder joint to a first surface of the laminate substrate. The assembly further includes a localized stiffener attached to a second surface of the laminate substrate so as to be directly opposite the circuit device. The localized stiffener is formed of a material and is shaped so that, when attached to the laminate substrate, the stiffener is capable of increasing the thermal cycle fatigue life of the one or more solder joints that attach the device to the substrate.


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