The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 2006
Filed:
Sep. 11, 2003
Applicants:
Kazuaki Sumita, Gunma-ken, JP;
Shingo Ando, Gunma-ken, JP;
Toshio Shiobara, Gunma-ken, JP;
Inventors:
Assignee:
Shin-Etsu Chemical Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 3/36 (2006.01); C08L 61/14 (2006.01); C08L 63/00 (2006.01); C08L 63/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
A liquid epoxy resin composition comprising a liquid epoxy resin, an aromatic amine curing agent having a phenolic hydroxyl group in a skeleton, an inorganic filler, and a cure accelerator is useful for semiconductor encapsulation. The composition is adherent to the surface of silicon chips, does not deteriorate under hot humid conditions, and is fully resistant to thermal shocks.
Sumita, Kazuaki. (2006). Liquid epoxy resin composition and semiconductor device (U.S. Patent No. 7094844). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7094844
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile