The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 22, 2006

Filed:

Mar. 26, 2003
Applicants:

Satoru Uchidoi, Osaka-fu, JP;

Yoshio Kojima, Nara-ken, JP;

Mitsuo Yamada, Osaka-fu, JP;

Seiji Yokoi, Aichi-ken, JP;

Satoshi Kodama, Aichi-ken, JP;

Inventors:

Satoru Uchidoi, Osaka-fu, JP;

Yoshio Kojima, Nara-ken, JP;

Mitsuo Yamada, Osaka-fu, JP;

Seiji Yokoi, Aichi-ken, JP;

Satoshi Kodama, Aichi-ken, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 13/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

With the use of a lead-free cationic electrodeposition coating composition containing a sulfonium-modified epoxy resin, an amine-modified novolak-type epoxy resin, and a blocked isocyanate curing agent as a binder resin, wherein the content of volatile organic components is 1% by weight or less, the coating liquid conductivity is 1000 to 2500 μS/cm, and the minimum film-forming temperature of the coated layer electrodeposited on an object to be coated is 20 to 35° C., electrodeposition coating is carried out at or above the temperature which is lower by 2° C. than the minimum film-forming temperature and at or below the temperature which is higher by 6° C. than the minimum film-forming temperature.


Find Patent Forward Citations

Loading…