The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 22, 2006

Filed:

Apr. 30, 2004
Applicants:

Bob J. Self, Colorado Springs, CO (US);

Donald M. Logelin, Colorado Springs, CO (US);

Robert H. Wardwell, Colorado Springs, CO (US);

Inventors:

Bob J. Self, Colorado Springs, CO (US);

Donald M. Logelin, Colorado Springs, CO (US);

Robert H. Wardwell, Colorado Springs, CO (US);

Assignee:

Agilent Technologies, Inc., Palo Alto, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An interconnect formed using a stiff layer having a plurality of holes extending there through. A first flexible layer is bonded to a first side of the stiff layer. The first flexible layer having a plurality of conductive bumps, each conductive bump being positioned over a hole. A second flexible layer is bonded to a second side of the stiff layer. The second flexible layer having a plurality of conductive bumps, each conductive bump being positioned over a hole. Signal paths are formed in the holes, the signal paths connecting the plurality of conductive bumps on the first layer to the plurality of conductive bumps on the second layer.


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