The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 2006
Filed:
Oct. 07, 2002
Kenji Yamada, Nagoya, JP;
Takashi Matsukubo, Nagoya, JP;
Keiji Matsumoto, Nagoya, JP;
NGK Insulators, Ltd., Nagoya, JP;
Abstract
A die for extrusion molding of a honeycomb which comprises a structure provided with a groovy slit () formed by cell blocks () on a front face thereof, and additionally provided with a puddle inlet, on a back face thereof, communicatively connected with the slit (), wherein each cell block () has a soft film () on a hard film () formed on outermost surfaces of the slit () and puddle inlet fabricated in a cell-block body (). According to the die for extrusion molding of a honeycomb, a dimensional error of the die is possible to be eliminated, a stable force of extrusion friction is possible to be maintained, both extrusion moldability and abrasion resistance are possible to be excellent, and additionally an adjustment of the die at the time of extrusion molding can be performed easily.