The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7093744 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 22, 2006

Filed:

Feb. 02, 2004
Applicants:

Kouji Seki, Gunma, JP;

Noriyasu Sakai, Gunma, JP;

Toshihiko Higashino, Gunma, JP;

Inventors:

Kouji Seki, Gunma, JP;

Noriyasu Sakai, Gunma, JP;

Toshihiko Higashino, Gunma, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention solves a problem that in a wire bonding process, an inert gas used for prevention of oxidation of a substrate gave rise to shimmer due to the temperature difference during bonding, thereby degrading the precision of pattern recognition. With this invention's bonding device, shielding lids, andare disposed at upper and lower parts of a ring illuminationand at a lower part of lens barrel. Shimmerof nitrogen gas that blows out from a working holecan thus be prevented from entering inside ring illumination, especially by shielding lidat the lower part of ring illumination. As a result, the recognition precision of a recognition camera can be improved and the wire bonding precision of the μm order can be improved.


Find Patent Forward Citations

Seki, Kouji. (2006). Recognition device, bonding device, and method of manufacturing a circuit device (U.S. Patent No. 7093744). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7093744

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